Dimension SMD (Surface Mounted Device) GOB (Glue on Board) COB (Chip on Board)
Technology LED chips are individually mounted on PCB SMD LEDs coated with protective epoxy layer LED chips directly bonded on PCB surface
Protection Level Standard protection Enhanced protection (anti-collision, dust, moisture) Highest protection (fully encapsulated surface)
Surface Durability Moderate, LED beads exposed Improved resistance to impact and humidity Very high durability, strong physical protection
Pixel Stability Mature and widely used More stable than SMD in harsh environments Very stable, fewer dead pixels in fine-pitch applications
Maintenance Easy module-level repair Slightly more complex due to glue layer More complex repair, module replacement preferred
Heat Dissipation Good Slightly reduced due to glue layer Excellent thermal integration design
Viewing Experience High maturity, wide viewing angles Smoother surface, reduced pixel exposure Ultra-smooth surface, excellent close viewing
Cost Level Lowest Medium Highest
Best Use Cases Standard indoor LED screens High-traffic areas, rental LED, semi-protection environments Fine-pitch LED, high-end display, XR, control rooms